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LC03-6R2 Low Capacitance Surface Mount TVS for High-Speed Data Interfaces
The LC03-6 transient voltage suppressor is designed to protect equipment attached to high speed communication lines from ESD, EFT, and lighting.
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* SO-8 Package * Peak Power - 2000 Watts 8 x 20 mS * ESD Rating:
IEC 61000-4-2 (ESD) 15 kV (air) 8 kV (contact) IEC 61000-4-4 (EFT) 40 A (5/50 ns) IEC 61000-4-5 (lighting) 23 (8/20 ms) UL Flammability Rating of 94V-0
SO-8 LOW CAPACITANCE VOLTAGE SUPPRESSOR 2 kW PEAK POWER 6 VOLTS
PIN CONFIGURATION AND SCHEMATIC
1 2 3 8 7 6 5
*
Typical Applications:
* High Speed Communication Line Protection
MAXIMUM RATINGS
Rating Peak Power Dissipation 8 x 20 mS @ TA = 25C (Note 1) Junction and Storage Temperature Range Lead Solder Temperature - Maximum 10 Seconds Duration Symbol Ppk TJ, Tstg TL Value 2000 -55 to +150 260 Unit W C
4
8 C 1 SO-8 CASE 751 PLASTIC
1. Non-repetitive current pulse 8 x 20 mS exponential decay waveform
MARKING DIAGRAM
LC036 LYWW
LC036= Device Code L = Location Code Y = Year WW = Work Week
ORDERING INFORMATION
Device LC03-6R2 Package SO-8 Shipping 2500/Tape & Reel
(c) Semiconductor Components Industries, LLC, 2002
1
April, 2002 - Rev. 0
Publication Order Number: LC03-6R2/D
LC03-6R2
ELECTRICAL CHARACTERISTICS
Characteristic Reverse Breakdown Voltage @ It = 1.0 mA Reverse Leakage Current @ VRWN = 5.0 Volts Maximum Clamping Voltage @ IPP = 50 A, 8 x 20 mS Maximum Clamping Voltage @ IPP = 100 A, 8 x 20 mS Between I/O Pins and Ground @ VR = 0 Volts, 1.0 MHz Between I/O Pins @ VR = 0 Volts, 1.0 MHz Symbol VBR IR VC VC Capacitance Capacitance Min 6.8 N/A N/A N/A - - Typ - - - - 16 8.0 Max - 20 15 20 25 12 Unit V mA V V pF pF
ELECTRICAL CHARACTERISTICS
(TA = 25C unless otherwise noted) UNIDIRECTIONAL (Circuit tied to Pins 1 and 3 or 2 and 3) Symbol IPP VC VRWM IR VBR IT QVBR IF VF ZZT IZK ZZK Parameter Maximum Reverse Peak Pulse Current Clamping Voltage @ IPP Working Peak Reverse Voltage Maximum Reverse Leakage Current @ VRWM Breakdown Voltage @ IT Test Current Maximum Temperature Coefficient of VBR Forward Current Forward Voltage @ IF Maximum Zener Impedance @ IZT Reverse Current Maximum Zener Impedance @ IZK VC VBR VRWM IF
I
IR VF IT
V
IPP
Uni-Directional TVS
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LC03-6R2
TYPICAL CHARACTERISTICS
10 IR, REVERSE LEAKAGE (mA) VZ, REVERSE VOLTAGE (V) 16 14 12 10 8 6 4 2 0 -80 -60 -40 -20 0 20 40 60 80 100 120 140
8
6
4
2 0 -80 -60 -40 -20 0 20 40 60 80 100 120 140 T, TEMPERATURE (C)
T, TEMPERATURE (C)
Figure 1. Reverse Voltage versus Temperature
Figure 2. Reverse Leakage versus Temperature
20 IPP, PEAK PULSE CURRENT (A) 18 16 14 12 10 8 6 4 2 0 0 10 20 30 40 50 60 70 80 90 100 110
100 % OF PEAK PULSE CURRENT 90 80 70 60 50 40 30 20 10 0 0
tr
PEAK VALUE IRSM @ 8 ms PULSE WIDTH (tP) IS DEFINED AS THAT POINT WHERE THE PEAK CURRENT DECAY = 8 ms HALF VALUE IRSM/2 @ 20 ms
tP
20
40 t, TIME (ms)
60
80
VC, CLAMPING VOLTAGE (V)
Figure 3. 8 x 20 ms Pulse Waveform
Figure 4. Clamping Voltage versus Peak Pulse Current
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LC03-6R2
APPLICATIONS INFORMATION The LC03-6 ON Semiconductor's device is a TVS Diode array designed to protect sensitive electronics such as communications systems, computers, and computer peripherals against damage due to transient over-voltage conditions caused by lightning, electrostatic discharge (ESD), and electrical fast transients (EFT). Because of its relative low capacitance (<25 pf), it can be used in high speed I/O data lines such as USB 1.1 ports. The integrated design of the LC03-6 device offers high surge rating, low capacitance steering diodes, and a TVS diode integrated in a single package (SO-8). In addition, this device offers compliance to Bellcore 1089 requirements (intra-building). LC03-6 Device's Configurations Options
Protection of Two High-speed I/O Data Lines
If differential protection is required by some particular applications, then the configuration for differential protection is made as shown in the Figure 6:
LC03-6 Line 1 In Line 1 Out
N/C N/C
N/C N/C
Line 2 In
Line 2 Out
Figure 6. Configuration for Differential Protection (Line-to-Line) T1/E1 Linecard Protection (Intra-Building)
The LC03-6 device is able to protect two high speed data lines against transient over-voltage conditions by driving them to a fixed reference point for clamping purposes. Depending in the application's requirements, the LC03-6 device can be configured for protection in either differential mode (Line-to-Line) or common mode (Line-to-ground). The Figure 5 shows the connection for Differential mode (Line-to-Line) and Common mode (Line-to-Ground) protection. The inputs and outputs of the I/O data lines are connected at terminals 1 to 8, and 4 to 5 while the terminals 2, 3, 6 and 7 are connected to ground; for better performance, it is recommended to minimize parasitic inductances by using ground planes and minimizing the PCB trace lengths for the ground return connections.
LC03-6 Line 1 In Line 1 Out
The Figure 7 shows a typical schematic for a T1/E1 line card protection circuit. The LC03-6 device is connected between Tip & Ring on the transmit and receive line pairs. it provides protection to metallic and common mode lightning surges per Bellcore 1089 intra-building (For further information, see Bellcore 1089 standard). A metallic voltage is defined as a difference of potential between the T and R terminals of a telecommunications pair. Currents caused by lightning, in the absence of protector operation and with balanced terminal equipment and telecommunications loop, cause Tip and Ring conductors to attain the same potential hence do not produce metallic transients. Common mode surges are suppressed by the isolation of the transformer.
Line 2 In
Line 2 Out
Figure 5. Configuration for Differential and Common Mode Protection
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LC03-6R2
PTC R1 RTIP R3 R2 RRING T1/E1 TRANSCEIVER R4 TTIP LC03-6 R5 TRING T2 PTC PTC T1 PTC LC03-6
Figure 7. Typical T1 Line Card Protection ESD Protection in USB 1.1 Port Applications
As know, a USB port is composed of four lines. The lines D+ & D- are used for bi-directional data transmission, and the remaining two lines are reserved for bus voltage and ground. Since USB is a hot plugging and unplugging system, all its four lines have the risk to receive ESD conditions in the real field of the application. Typical ESD protection techniques are commonly formed by the combination of different discrete semiconductor products which make this technique obsolete and non-efficient because the interconnections of the discrete devices increase the parasitic inductance effects during a transient condition which reduces significantly the
performance of the ESD protection circuit. The LC03-6 device provides a unique TVS Diode array designed to protect two I/O data lines (single USB port) against damage due to ESD conditions or transient voltage conditions. Because of its low capacitance, it can be used in high speed I/O data lines such as USB 1.1 components. In addition to its low capacitance characteristics, the LC03-6 device from ON Semiconductor complies with the most common industrial standards for ESD, EFT and surge protection: IEC61000-4-2, IEC61000-4-4, IEC61000-4-5. The Figure 8 illustrates how to connect the LC03-6 device in combination with the SRDA05-4 device to protect USB 1.1 ports against ESD conditions:
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LC03-6R2
VBUS VBUS D+ D- GND UPSTREAM USB PORT RT RT VBUS CT CT VBUS SRDA05-4 GND DOWNSTREAM USB PORT VBUS VBUS RT RT D+ D- GND DOWNSTREAM USB PORT VBUS VBUS D+ D-
USB CONTROLLER LC03-6
CT
CT
Figure 8. ESD Protection for USB 1.1 Port Applications
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LC03-6R2
Transient Voltage Suppressor - Surface Mount
2 kW Peak Power
SO-8 CASE 751-07 ISSUE W
-X- A
8 5 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. DIM A B C D G H J K M N S MILLIMETERS MIN MAX 4.80 5.00 3.80 4.00 1.35 1.75 0.33 0.51 1.27 BSC 0.10 0.25 0.19 0.25 0.40 1.27 0_ 8_ 0.25 0.50 5.80 6.20 INCHES MIN MAX 0.189 0.197 0.150 0.157 0.053 0.069 0.013 0.020 0.050 BSC 0.004 0.010 0.007 0.010 0.016 0.050 0_ 8_ 0.010 0.020 0.228 0.244
B
1 4
S
0.25 (0.010)
M
Y
M
-Y- G C -Z- H D 0.25 (0.010)
M SEATING PLANE
K
N
X 45 _
0.10 (0.004)
M
J
ZY
S
X
S
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LC03-6R2
ON Semiconductor is a trademark and is a registered trademark of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer.
PUBLICATION ORDERING INFORMATION
Literature Fulfillment: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303-675-2175 or 800-344-3860 Toll Free USA/Canada Fax: 303-675-2176 or 800-344-3867 Toll Free USA/Canada Email: ONlit@hibbertco.com N. American Technical Support: 800-282-9855 Toll Free USA/Canada JAPAN: ON Semiconductor, Japan Customer Focus Center 4-32-1 Nishi-Gotanda, Shinagawa-ku, Tokyo, Japan 141-0031 Phone: 81-3-5740-2700 Email: r14525@onsemi.com ON Semiconductor Website: http://onsemi.com For additional information, please contact your local Sales Representative.
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LC03-6R2/D

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